MindMap Gallery Microelectronics packaging technology types
This map provides a detailed summary of the types of microelectronic packaging technologies. The corresponding packaging technology types are also equipped with Chinese and English abbreviations and full English names.
Edited at 2021-12-16 20:30:59This Valentine's Day brand marketing handbook provides businesses with five practical models, covering everything from creating offline experiences to driving online engagement. Whether you're a shopping mall, restaurant, or online brand, you'll find a suitable strategy: each model includes clear objectives and industry-specific guidelines, helping brands transform traffic into real sales and lasting emotional connections during this romantic season.
This Valentine's Day map illustrates love through 30 romantic possibilities, from the vintage charm of "handwritten love letters" to the urban landscape of "rooftop sunsets," from the tactile experience of a "pottery workshop" to the leisurely moments of "wine tasting at a vineyard"—offering a unique sense of occasion for every couple. Whether it's cozy, experiential, or luxurious, love always finds the most fitting expression. May you all find the perfect atmosphere for your love story.
The ice hockey schedule for the Milano Cortina 2026 Winter Olympics, featuring preliminary rounds, quarterfinals, and medal matches for both men's and women's tournaments from February 5–22. All game times are listed in Eastern Standard Time (EST).
This Valentine's Day brand marketing handbook provides businesses with five practical models, covering everything from creating offline experiences to driving online engagement. Whether you're a shopping mall, restaurant, or online brand, you'll find a suitable strategy: each model includes clear objectives and industry-specific guidelines, helping brands transform traffic into real sales and lasting emotional connections during this romantic season.
This Valentine's Day map illustrates love through 30 romantic possibilities, from the vintage charm of "handwritten love letters" to the urban landscape of "rooftop sunsets," from the tactile experience of a "pottery workshop" to the leisurely moments of "wine tasting at a vineyard"—offering a unique sense of occasion for every couple. Whether it's cozy, experiential, or luxurious, love always finds the most fitting expression. May you all find the perfect atmosphere for your love story.
The ice hockey schedule for the Milano Cortina 2026 Winter Olympics, featuring preliminary rounds, quarterfinals, and medal matches for both men's and women's tournaments from February 5–22. All game times are listed in Eastern Standard Time (EST).
Microelectronics packaging technology types
1||| SMT (surface mount technology)
wing pins
Does not distinguish between
SOT package: (Small Outline Transistor) small outline transistor
both sides
SOP package: (Small Out-Line Package) Double-sided pin small outline package
SSOP package: (Shrink Small-Outline Package) narrow pitch small outline plastic package
TSSOP package: (Thin Shrink Small Outline Package) Thin Shrink Small Outline Package
VSOP package: (Very Small Outline Package) Very small outline package
TSOP package: (Thin Small Outline Package) Thin Small Outline Package
HSOP package: (Head Sink Small Outline Packages) SOP with heat sink
four sides
QFP packaging: (Plastic Quad Flat Package) square flat packaging technology
TQFP package: (Thin quad flat package) thin plastic four-corner flat package
LQFP package: (Low-profile Quad Flat Package) Thin QFP
PQFP package: (Plastic Quad Flat Package) plastic square flat package
MQFP package: (Metric quad flatpackage) The substrate and cover are made of aluminum and sealed with adhesive
BQFP package: (Quad flat package with bumper) Four-side pin flat package with buffer pad
CQFP package: (Quad fiat package with guard ring) Four-side pin flat package with guard ring
SQFP packages: (Shorten Quad Flat Packages) Shrunk fine pitch QFP
RQFP package: with metal bulk body on the surface
FQFP package: (Fine pitch quad flat packagge) small pin center distance QFP
J-shaped lead
both sides
SOJ package: (Small Outline J-Lead) small size J-shaped lead package
four sides
LCC packaging: (Leadless Chip Carriers) designed for pinless chip packaging
CLCC package: (Ceramic leaded chip carrier) ceramic chip carrier with leads
PLCC package: (Plastic Leaded Chip Carrier) Plastic chip carrier with leads
JLCC package: (J-leaded chip carrier) J-shaped lead chip carrier
The solder joint is on the bottom of the device
ball pin
BGA package: (Ball Grid Array Package) ball grid array package
FBGA package: (Fine-Pitch Ball Grid Array) fine-pitch ball grid array
CBGA package: (C-ceramic) ceramic ball array package
PBGA package: (Plastic Ball Grid Array) plastic ball array package
FCBGA package: (Flip Chip Ball Grid Array) Flip chip ball grid array package
2||| THT (Through-hole insertion technology)
The solder joint is on the bottom of the device
pin pin
PGA package: (Pin Grid Array Package) pin grid array packaging technology
CPGA package: (Ceramic PGA) ceramic pin grid array package
CCGA package (ceramic column gridarray) ceramic column grid array
Straight pin
both sides
DIP package: (dual inline-pin package) Dual in-line packaging technology
PDIP package: (PDIP Plastic Dual In-Line Package) plastic dual in-line package
SDIP package: (Shrink dual in-line package) Shrink DIP plug-in package
SKDIP package: (Skinny Dual in-line Packages) shrinkable dual in-line package
DIP-tab package: P-(tad) plastic package DIP
CDIP package: C-(ceramic) ceramic package DIP
unilateral
SIP packaging: (System In a Package) system level packaging
irregular
TO package: (Transistor Outline) transistor package